Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-05-30
2006-05-30
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S780000, C257S787000, C257S774000
Reexamination Certificate
active
07053486
ABSTRACT:
A semiconductor device comprises a base frame having a first surface and a second surface which opposes the first surface, and having an opening portion a semiconductor chip30which includes a first main surface on which a plurality of electrode pads is provided and a second main surface, and which is disposed within the opening portion; an insulating film formed on the first surface and first main surface; a plurality of wiring patterns which extend from the electrode pads, respectively to the upper side of the first surface of the base frame, respectively; a sealing portion formed on the wiring patterns and insulating film; and a plurality of external terminals provided on the wiring patterns in a region including the upper side of the base frame.
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Oki Electric Industry Co. Ltd.
Parekh Nitin
Rabin & Berdo PC
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