Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate
2008-01-29
2008-01-29
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
C257S693000, C257S737000, C257S738000, C257SE23069
Reexamination Certificate
active
07323778
ABSTRACT:
A semiconductor device comprises: a semiconductor chip; an extension portion formed in contact with the side surfaces so as to surround the semiconductor chip; an insulating film formed on a surface of the extension portion and the semiconductor chip; each of a plurality of wiring patterns electrically connected to each electrode pad, respectively and extended from the electrode pads to the surface of the extension portion; a sealing portion formed such that a part of each of the wiring patterns is exposed; and a plurality of external terminals provided over the wiring patterns in a region including the upper side of the extension portion.
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Lee Eugene
OKI Electric Industry Co., Ltd.
Rabin & Berdo PC
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