Semiconductor device with heat sink and method for...

Details Semiconductor device with heat sink and method for... Semiconductor device with heat sink and method for...

2011-05-17

2011-05-17

Le, Thao X (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S707000, C257S712000, C257S717000, C257SE23101, C257SE21504, C438S618000

Reexamination Certificate

active

07943430

ABSTRACT:
A semiconductor device and a method for manufacturing the same are described. The semiconductor device comprises: a heat sink having at least one opening passing through the heat sink; at least one semiconductor chip disposed in the opening, wherein the semiconductor chip includes a first side and a second side on opposite sides; an electricity conducting thin film filling in a first depth portion of the opening, wherein the second side of the semiconductor chip is embedded in the electricity conducting thin film; a heat conducting thick film filling in a second depth portion of the opening, wherein the electricity conducting thin film is directly connected with the heat conducting thick film; at least one wire electrically connecting the semiconductor chip and an external circuit; and an encapsulant covering a portion of the heat sink, the semiconductor chip, the wire and an exposed portion of the electricity conducting thin film.

REFERENCES:
patent: 4069498 (1978-01-01), Joshi
patent: 4103321 (1978-07-01), Gansert et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5796582 (1998-08-01), Katchmar
patent: 6430047 (2002-08-01), Wentzel et al.
patent: 6670751 (2003-12-01), Song et al.

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