Semiconductor device with heat radiating plate and positioning d

Details Semiconductor device with heat radiating plate and positioning d Semiconductor device with heat radiating plate and positioning d

1997-04-17

1998-10-27

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257675, 257676, 257713, 257707, 257695, H01L 2302

Patent

active

058280006

ABSTRACT:
A semiconductor device including an insulating package outer frame member, outer leads, positioning dummy leads, a heat radiating plate, and a semiconductor chip mounted to the heat radiating plate. The heat radiating plate is made from a different material from that of the outer leads, and the positioning dummy leads act to regulate the position of the heat radiating plate during the soldering process. The positioning dummy leads and the outer leads are made in a common lead frame, and are separated from each other after the soldering process, preferably after the subsequent plating process.

REFERENCES:
patent: 5309322 (1994-05-01), Wagner et al.
patent: 5661337 (1997-08-01), Manteghi

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