Semiconductor device with good thermal behavior

Details Semiconductor device with good thermal behavior Semiconductor device with good thermal behavior

1996-02-28

1999-11-09

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257667, H01L 23495

Patent

active

059820284

ABSTRACT:
One embodiment of a semiconductor device includes a semiconductor chip having long sides. A system carrier is connected to the semiconductor chip and has an island. The island has an opening formed centrally therein over a large area. The opening is wider than the semiconductor chip on two of the long sides of the semiconductor chip. Another embodiment of a semiconductor device includes a semiconductor chip having corner regions. A system carrier is connected to the semiconductor chip and has an island with an opening formed therein. The semiconductor chip is joined to the island only in the corner regions.

REFERENCES:
patent: 5010390 (1991-04-01), Tanaka
patent: 5233222 (1993-08-01), Djennas et al.
patent: 5483098 (1996-01-01), Joiner, Jr.
Patent Abstracts of Japan No. 6-85145 A (Akishima), dated Mar. 25, 1994.

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