Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate
2005-11-15
2005-11-15
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Including dielectric isolation means
C257S506000, C438S424000
Reexamination Certificate
active
06965155
ABSTRACT:
A semiconductor device includes: an element isolation region in a semiconductor substrate; an active area in the semiconductor substrate; an interlayer insulation film on the element isolation region and the active area; an opening to which the element isolation region, the active area and a boundary therebetween are exposed; a glue layer in the opening; and a conductor on the glue layer. The element isolation region isolates the active area in the semiconductor substrate, and the active area overlaps a top surface of the isolation region.
REFERENCES:
patent: 5683924 (1997-11-01), Chan et al.
patent: 5821153 (1998-10-01), Tsai et al.
patent: 5930620 (1999-07-01), Wristers et al.
patent: 5956598 (1999-09-01), Huang et al.
patent: 6063676 (2000-05-01), Choi et al.
patent: 6124627 (2000-09-01), Rodder et al.
patent: 6127233 (2000-10-01), Rodder
patent: 6137149 (2000-10-01), Kodama
patent: 6294823 (2001-09-01), Arafa et al.
patent: 6307251 (2001-10-01), Sekikawa et al.
patent: 0 747 941 (1996-11-01), None
patent: 0 785 573 (1997-07-01), None
Kabushiki Kaisha Toshiba
Le Dung A.
Pillsbury Winthrop Shaw & Pittman LLP
LandOfFree
Semiconductor device with glue layer in opening does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device with glue layer in opening, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with glue layer in opening will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3507936