Semiconductor device with fuse function

Details Semiconductor device with fuse function Semiconductor device with fuse function

1988-03-09

1990-07-24

Carroll, J.

357 71, 357 75, 357 81, H01L 2702, H01L 2348, H01L 2326, H01L 2302

Patent

active

049438425

ABSTRACT:
A semiconductor device includes a radiation plate, first and second conductive patterns formed on one surface of the radiation plate, a first semiconductor element fixed on and connected to the first conductive pattern, a second semiconductor element fixed on and connected to the second conductive pattern, a conductive member for connecting the first and second semiconductor elements to each other, a first external terminal electrically connected to the first conductive pattern, a second external terminal electrically connected to the second conductive pattern, a third external terminal electrically connected to the conductive member, and an outer casing, which is filled wiht epoxy resin, for enclosing the semiconductor elements and the first to third external terminals. Part of each of the first to third external terminals is exposed to an exterior of the casing. At least one of the conductive member, first external terminal, second external terminal, and third external terminal includes a hollow fuse.

REFERENCES:
patent: 2486202 (1949-10-01), Phipps
patent: 3236976 (1966-02-01), Raypro
patent: 3236979 (1966-02-01), Rayno
patent: 3601737 (1971-08-01), Bard et al.
patent: 3710295 (1973-01-01), Staub et al.
patent: 3832606 (1974-08-01), Furnival
patent: 4169271 (1979-09-01), Saitoh
patent: 4189695 (1982-02-01), Hirahara
patent: 4740485 (1988-04-01), Sharpe-Geisler
patent: 4845545 (1989-07-01), Abramowitz et al.
European Search Report.
Patent Abstracts of Japan, vol. 10, No. 248, (E-341), (2304), 8/26/86, corresponding to Japanese Patent No. 61-77353.

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