Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2005-02-08
2005-02-08
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S758000
Reexamination Certificate
active
06853050
ABSTRACT:
A semiconductor device comprises a semiconductor substrate having a bonding pad region; and a bonding pad and a fuse box formed in the bonding pad region. Thus, the chip size can be reduced and the manufacturing yield can be increased.
REFERENCES:
patent: 6242789 (2001-06-01), Weber et al.
Marger Johnson & McCollom PC
Nguyen Cuong
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