Semiconductor device with fuse box and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S758000

Reexamination Certificate

active

06853050

ABSTRACT:
A semiconductor device comprises a semiconductor substrate having a bonding pad region; and a bonding pad and a fuse box formed in the bonding pad region. Thus, the chip size can be reduced and the manufacturing yield can be increased.

REFERENCES:
patent: 6242789 (2001-06-01), Weber et al.

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