Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate
2005-10-18
2005-10-18
Eckert, George (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
C257S734000, C257S736000, C257S737000, C257S738000
Reexamination Certificate
active
06956288
ABSTRACT:
A semiconductor device to be mounted on an external electronic device includes a film substrate on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering member; and a semiconductor chip mounted on the film substrate. In this semiconductor device, the film substrate is folded so that at least one edge of the film substrate is on a side opposite to a side on which the semiconductor chip is mounted, and portions of the wiring electrodes exposed from the covering member on a surface of the film substrate on which the semiconductor chip is mounted are to be connected to electrodes of an external electronic device.
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Tanaka Takayuki
Torii Michiharu
Ueno Junichi
Eckert George
Fenty Jesse A.
Hamre Schumann Mueller & Larson P.C.
Matsushita Electric - Industrial Co., Ltd.
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