Semiconductor device with enhanced adhesion between heat spreade

Details Semiconductor device with enhanced adhesion between heat spreade Semiconductor device with enhanced adhesion between heat spreade

1992-11-10

1995-03-28

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257 43, 257675, 257706, 257712, 257717, 257753, H01L 2328, H01L 2348, H01L 2944, H01L 2952

Patent

active

054020069

ABSTRACT:
A semiconductor device (10) includes a semiconductor die (18) and a heat spreader (16) adjacent the semiconductor die (18) for carrying heat away from the semiconductor die (18). The heat spreader (16) has a copper core (30) and a cupric oxide coating (32) formed on at least a portion of the core (30). A plastic package (12) is molded onto the semiconductor die (18) and the heat spreader (16) for supporting the semiconductor die (18) and the heat spreader (16). The cupric oxide coating (32) enhances adhesion of the heat spreader (16) to the plastic package (12).

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ASTM (American Society for Testing and Materials) Designation D 2651-79 (Reapproved 1984).
"Standard Practice for Preparation of Metal Surfaces for Adhesvive Bonding", pp. 166-170.

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