Semiconductor device with electrical connection between semicond

Details Semiconductor device with electrical connection between semicond Semiconductor device with electrical connection between semicond

1997-03-06

1999-04-20

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257712, 257783, 257778, 257796, H01L 23053

Patent

active

058959718

ABSTRACT:
An adhesive compound layer bonds the reverse surface of a semiconductor chip to a major surface of a substrate, and a restoring compound layer is formed on a top surface of the semiconductor chip; the adhesive compound layer and the restoring compound layer exert a first force on the reverse surface and a second force on the top surface due to shrinkage during a thermosetting so that a first moment due to the first force is reduced or canceled by a second moment due to the second force, thereby preventing the semiconductor chip from undesirable warp.

REFERENCES:
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5627407 (1997-05-01), Suhir et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5646204 (1997-07-01), Akiba et al.

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