Semiconductor device with decoupling capacitors mounted on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

Reexamination Certificate

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C257S691000, C257S778000, C257S738000, C257S737000, C257S303000, C257S758000, C257S700000, C257S532000, C257S528000, C257S759000, C257S296000, C257S516000, C257S603000, C257S595000, C257S534000, C257S535000, C257S288000, C257S395000, C257S302000

Reexamination Certificate

active

06949815

ABSTRACT:
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads5electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.

REFERENCES:
patent: 5089878 (1992-02-01), Lee
patent: 5099306 (1992-03-01), Dunaway et al.
patent: 5349496 (1994-09-01), Taniguchi et al.
patent: 5933712 (1999-08-01), Bernhardt et al.
patent: 5950292 (1999-09-01), Dimos et al.
patent: 2003/0075789 (2003-04-01), Kawamura et al.
patent: 2003/0198006 (2003-10-01), Kuroda et al.
patent: 4-277665 (1992-10-01), None
patent: 4-354318 (1992-12-01), None
patent: 08017960 (1996-01-01), None
patent: 2001-223340 (2001-08-01), None
patent: 2002-280263 (2002-09-01), None
“Think Film Integrated Decoupling Capacitor With Redundancy”, Apr. 1, 1985, IBM Technical Disclosure Bulletin Apr. 1985, vol 27 Issue No. 11, pp. 6791-6793, TDB-ACC-NO; NN85046791.
“Directly Attached Decoupliing Capacitors and Fabrication Process”, Nov. 1, 1989, IBM Technical Disclosure Nov. 1989, vol. 32 Issue No. 6B, pp. 330-331, TDB-ACC-NO: NB8911330.
Chip Attachment Structure for High Performance, Efficiently Cooled Semiconductor Chip Carrier, Oct. 1, 1982, IBM Technical Disclosure Oct. 1982, vol. 25 Issue No. 5, pp. 2544-2546, TDB-ACC-NO: NNB2102544.
“Decoupled Capacitor Placement”, Jan. 1, 1977, IBM Technical Disclosure Nov. 1977, vol. 19 Issue No. 8, pp, 3046-3047, TDB-ACC-NO; NN77013046.

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