Semiconductor device with composite metal heat-radiating plate o

Details Semiconductor device with composite metal heat-radiating plate o Semiconductor device with composite metal heat-radiating plate o

1976-07-01

1977-11-08

James, Andrew J.

Electric lamp and discharge devices

With temperature modifier

For lead-in-seal or stem protection

357 72, 313311, 165 80, 174 16HS, H01L 2302, H01L 2328

Patent

active

040578259

ABSTRACT:
A semiconductor device has a composite metal heat-radiating plate consisting of, for example, two copper layers for serving as a thermally and electrically conducting medium and an iron layer for giving mechanical strength, interposed between the copper layers, in which the semiconductor element is directly or indirectly, electrically and mechanically coupled by soldering to one of the copper layers.

REFERENCES:
patent: 2484311 (1949-10-01), Prakke et al.
patent: 3143684 (1964-08-01), Miller
patent: 3449506 (1969-06-01), Weinstein et al.
patent: 3922712 (1975-11-01), Stryker

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