Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2006-12-28
2009-06-09
Purvis, Sue (Department: 2826)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C257S529000, C257SE23149
Reexamination Certificate
active
07544543
ABSTRACT:
A semiconductor device with a capacitor and a fuse, and a method for manufacturing the same are described. The semiconductor device comprises a semiconductor substrate having a capacitor region and a fuse region defined therein, a insulating layer over the semiconductor substrate, a storage node hole formed in the insulating layer, a barrier metal in the storage node hole, a dielectric layer formed on the barrier metal and the insulating layer, a lower metal layer for a plate electrode filling the storage node hole such that it is flush with the dielectric layer, an upper metal layer for the plate electrode on the dielectric layer and lower metal layer for the plate electrode; and a fuse metal layer formed of the same material as that of the upper metal layer for the plate electrode on the dielectric layer in the fuse region.
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Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
Purvis Sue
Sandvik Benjamin P
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