Semiconductor device with a semiconductor chip using lead...

Details Semiconductor device with a semiconductor chip using lead... Semiconductor device with a semiconductor chip using lead...

2007-02-26

2010-02-02

Vu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

C257S692000, C257S773000, C257S778000, C257S781000, C257S782000, C257SE23035, C257SE23041

Reexamination Certificate

active

07656033

ABSTRACT:
A semiconductor device using lead technology includes a semiconductor chip with external side electrodes of semiconductor components disposed on its top side. On its rear side, the semiconductor chip is connected to a rear side internal lead adapted to the rear side of semiconductor chip. On its top side, the semiconductor chip is connected a plurality of top side internal leads. The top side internal leads are electrically connected to external leads of the semiconductor device.

REFERENCES:
patent: 4532443 (1985-07-01), Glennon
patent: 5554561 (1996-09-01), Plumton
patent: 5610085 (1997-03-01), Yuan et al.
patent: 5624860 (1997-04-01), Plumton et al.
patent: 5712189 (1998-01-01), Plumton et al.
patent: 5747842 (1998-05-01), Plumton
patent: 5889298 (1999-03-01), Plumton et al.
patent: 6040626 (2000-03-01), Cheah et al.
patent: 6097046 (2000-08-01), Plumton
patent: 6229197 (2001-05-01), Plumton et al.
patent: 6307755 (2001-10-01), Williams et al.
patent: 6479888 (2002-11-01), Hirashima et al.
patent: 6569764 (2003-05-01), Hirashima et al.
patent: 6720642 (2004-04-01), Joshi et al.
patent: 6762067 (2004-07-01), Quinones et al.
patent: 6774466 (2004-08-01), Kajiwara et al.
patent: 6867489 (2005-03-01), Estacio
patent: 6870254 (2005-03-01), Estacio et al.
patent: 2001/0033022 (2001-10-01), Ewer
patent: 2001/0040277 (2001-11-01), Lam et al.
patent: 2001/0044167 (2001-11-01), Kuo
patent: 2002/0171126 (2002-11-01), Estacio et al.
patent: 2002/0179994 (2002-12-01), Chen et al.
patent: 2003/0062608 (2003-04-01), Hamachi
patent: 2003/0075786 (2003-04-01), Joshi et al.
patent: 2004/0063240 (2004-04-01), Madrid et al.
patent: 2004/0119118 (2004-06-01), Williams et al.
patent: 2004/0130009 (2004-07-01), Tangpuz et al.
patent: 2004/0130011 (2004-07-01), Estacio et al.
patent: 2004/0201081 (2004-10-01), Joshi et al.
patent: 2005/0001293 (2005-01-01), Estacio
patent: 2005/0012117 (2005-01-01), Fukuhara
patent: 2005/0023670 (2005-02-01), Hata et al.
patent: 2005/0048758 (2005-03-01), Hosseini et al.
patent: 2005/0121784 (2005-06-01), Standing
patent: 2005/0218498 (2005-10-01), Hata et al.
patent: 2005/0272257 (2005-12-01), Fuchs et al.
patent: 2006/0017174 (2006-01-01), Otremba
patent: 2006/0138532 (2006-06-01), Okamoto et al.
patent: 2007/0040186 (2007-02-01), Fillion et al.
patent: 10134943 (2002-10-01), None
patent: 0966038 (1999-12-01), None
patent: 1357594 (2003-10-01), None
patent: 0124260 (2001-04-01), None

Affiliated with

Also associated with

Rating

Semiconductor device with a semiconductor chip using lead... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with a semiconductor chip using lead..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with a semiconductor chip using lead... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4182097