Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-03-18
2008-03-18
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S691000, C257S725000
Reexamination Certificate
active
11362507
ABSTRACT:
A semiconductor device includes a plastic package, at least one semiconductor chip and a rewiring level. The rewiring level includes an insulating layer and a rewiring layer. The rewiring layer includes either signal conductor paths and ground or supply conductor paths arranged parallel to one another and alternately, or only signal conductor paths arranged parallel to one another. In the latter case, an electrically conducting layer of metal which can be connected to ground or supply potential is additionally provided as a termination of the rewiring level or in the form of a covering layer.
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Gospodinova-Daltcheva Minka
Huebert Harry
Subraya Rajesh
Thomas Jochen
Wennemuth Ingo
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Patton Paul E
LandOfFree
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