Semiconductor device with a plurality of ground planes

Details Semiconductor device with a plurality of ground planes Semiconductor device with a plurality of ground planes

2008-12-30

2010-10-05

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S690000, C257S723000

Reexamination Certificate

active

07808092

ABSTRACT:
A multi-chip module (MCM) with a plurality of ground planes/layers is provided. Each integrated circuit (IC) chip of the MCM has its own ground plane on a substrate in the MCM. This MCM structure may facilitate separate testing of each IC chip without affecting other chips and without being affected by other chips. This MCM structure also may facilitate testing of interconnects/connections between two or more chips.

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Wolf, et al., “Silicon Processing for the VLSI Era,” 2000, vol. I, Lattice Press, pp. 857-858.

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