Semiconductor device with a package having a plurality of bump e

Details Semiconductor device with a package having a plurality of bump e Semiconductor device with a package having a plurality of bump e

1997-03-19

1999-03-30

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257738, 257678, 438613, H01L 2348, H01L 2552, H01L 2940

Patent

active

058893270

ABSTRACT:
A semiconductor device is formed of stacked first and second semiconductor substrates each having internal circuits which are packaged within a package having a plurality of bump electrodes on the top and bottom principal planes. The bump electrodes on the top principal plane of the package are electrically connected to the internal circuits of the first semiconductor substrate and the bump electrodes on the bottom plane of the semiconductor substrate are electrically connected to the internal circuit of the second semiconductor substrate with the first and second semiconductor substrates arranged in mirror symmetry both physically with respect to each other and with respect to signals to be input into or output from the internal circuits. Module structures using a plurality of the semiconductor devices mentioned above are also described.

REFERENCES:
patent: 3984860 (1976-10-01), Logue
patent: 4860087 (1989-08-01), Matsubara et al.
patent: 5082802 (1992-01-01), Gelsomini
patent: 5258648 (1993-11-01), Lin
patent: 5399898 (1995-03-01), Rostoker
patent: 5426263 (1995-06-01), Potter et al.
patent: 5477933 (1995-12-01), Nguyen
patent: 5705858 (1998-01-01), Tsukamoto
patent: 5717229 (1998-02-01), Zhu

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