Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate
2007-04-17
2007-04-17
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
C257S758000, C257S797000, C438S462000
Reexamination Certificate
active
11437658
ABSTRACT:
A semiconductor device includes an alignment mark which is arranged adjacent to each corner of a semiconductor chip, and a plug which contacts the alignment mark. The alignment mark is formed by part of the uppermost interconnection layer in a multilevel interconnection which is formed on the semiconductor chip and obtained by stacking low-permittivity insulating layers and interconnection layers. The plug is buried in a contact hole formed in the low-permittivity insulating layer below the alignment mark, and contacts the alignment mark.
REFERENCES:
patent: 5270255 (1993-12-01), Wong
patent: 5401691 (1995-03-01), Caldwell
patent: 5627110 (1997-05-01), Lee et al.
patent: 5783490 (1998-07-01), Tseng
patent: 5933744 (1999-08-01), Chen et al.
patent: 5939132 (1999-08-01), Fujii et al.
patent: 6392300 (2002-05-01), Koike
patent: 2005/0140013 (2005-06-01), Ueno
patent: 5-109873 (1993-04-01), None
patent: 10-199790 (1998-07-01), None
patent: 2000-150429 (2000-05-01), None
patent: 2001-15403 (2001-01-01), None
patent: 2002-93750 (2002-03-01), None
Chambliss Alonzo
Kabushiki Kaisha Toshiba
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
LandOfFree
Semiconductor device with a multilevel interconnection... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device with a multilevel interconnection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with a multilevel interconnection... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3788418