Semiconductor device with a light emitting semiconductor die

Details Semiconductor device with a light emitting semiconductor die Semiconductor device with a light emitting semiconductor die

2011-04-05

2011-04-05

Hu, Shouxiang (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S778000, C257SE33056, C257SE33062, C257SE33065, C257SE33066

Reexamination Certificate

active

07919787

ABSTRACT:
A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

REFERENCES:
patent: 2907925 (1959-10-01), Parsons
patent: 4843280 (1989-06-01), Lumbard et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5177593 (1993-01-01), Abe
patent: 5298687 (1994-03-01), Rapoport et al.
patent: 5440075 (1995-08-01), Kawakita et al.
patent: 5640048 (1997-06-01), Selna
patent: 5670797 (1997-09-01), Okazaki
patent: 5986885 (1999-11-01), Wyland
patent: 6084295 (2000-07-01), Horiuchi et al.
patent: 6191477 (2001-02-01), Hashemi
patent: 6242280 (2001-06-01), Koay et al.
patent: 6262513 (2001-07-01), Furukawa et al.
patent: 6268654 (2001-07-01), Glenn et al.
patent: 6362525 (2002-03-01), Rahim
patent: 6383835 (2002-05-01), Hata et al.
patent: 6392294 (2002-05-01), Yamaguchi
patent: 6620720 (2003-09-01), Moyer et al.
patent: 6707247 (2004-03-01), Murano
patent: 6828510 (2004-12-01), Asai et al.
patent: 7098593 (2006-08-01), Teng
patent: 7256486 (2007-08-01), Lee et al.
patent: 2002/0139990 (2002-10-01), Suehiro et al.
patent: 2002/0179335 (2002-12-01), Curcio et al.
patent: 2003/0017645 (2003-01-01), Kabayashi et al.
patent: 2003/0020126 (2003-01-01), Sakamoto et al.
patent: 2003/0040138 (2003-02-01), Kabayashi et al.
patent: 2003/0168256 (2003-09-01), Chien
patent: 2004/0222433 (2004-11-01), Mazzochette et al.
Syd R. Wilson, Clarence J. Tracy, and John L. Freeman, Jr., “Handbook of Multilevel Metallization for Integrated Circuits,” Noyes Publ., Westwood, New Jersey (1993), pp. 868-872.
Electronic Packaging and Production, “Innovative PCB Reinforcement,” (Feb. 1997), p. 1.
Johannes Adam, “New Correlations Between Electrical Current and Temperature Rise in PCB Traces,” Proc. 20th IEEE Semi-Therm Symp., (Mar. 2004), pp. 1-8.

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