Patent
1987-11-20
1989-04-18
James, Andrew J.
357 71, H01L 2946
Patent
active
048231827
ABSTRACT:
A semiconductor device is disclosed, in which a titanium nitride film containing boron or carbon is provided between a semiconductor substrate and an aluminum film. Non-reacted substances in the titanium nitride film are rendered inactive by boron or carbon contained in the titanium nitride film. Thus, it is possible to improve the barrier properties of the titanium nitride film as mutual diffusion prevention film and also ensure good electric conductivity.
REFERENCES:
patent: 4502209 (1985-03-01), Eizenberg et al.
patent: 4574298 (1986-03-01), Yamagishi et al.
Jackson, Jr. Jerome
James Andrew J.
Kabushiki Kaisha Toshiba
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