Semiconductor device with a bump including a bump electrode film

Details Semiconductor device with a bump including a bump electrode film Semiconductor device with a bump including a bump electrode film

1998-11-10

2000-12-05

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257780, H01L 2348, H01L 2352, H01L 2940

Patent

active

061570796

ABSTRACT:
On a semiconductor substrate provided with an integrated circuit and electrode pads, an insulating film is formed to have an opening portion so as to cover the edge of each electrode pad and to expose the inside thereof. A projecting photoresist is formed to leave a partially exposed portion not covered above the electrode pad. A bump electrode film connecting to the exposed portion of the electrode pad is formed on the surface of the projecting photoresist with an electroless plating or sputtering. Thus, a semiconductor device for surface mounting is formed.

REFERENCES:
patent: 3585461 (1971-06-01), Eynon et al.
patent: 4042954 (1977-08-01), Harris
patent: 4922322 (1990-05-01), Mathew
patent: 5046161 (1991-09-01), Takada
patent: 5134460 (1992-07-01), Brady et al.
patent: 5272111 (1993-12-01), Kosaki
patent: 5478973 (1995-12-01), Yoon et al.
patent: 5925931 (1999-07-01), Yamamoto
patent: 5943597 (1999-08-01), Kleffner et al.

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