Semiconductor device wired with fuse

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state

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438130, 438467, 438659, H04L 2182

Patent

active

057417318

ABSTRACT:
A method of manufacturing a semiconductor device including the steps of: forming an insulating film on an electrical connection area; forming a contact hole in the insulating film; forming a crystalline semiconductor region in the contact hole; forming a wiring layer covering the contact hole; and selectively implanting ions over the wiring layer by using a resist mask to make the crystalline semiconductor region have a high resistance. A semiconductor device having customized wiring connections can be manufactured in a short term.

REFERENCES:
patent: 4814285 (1989-03-01), Matlock et al.
patent: 4835118 (1989-05-01), Jones, Jr. et al.
patent: 5017510 (1991-05-01), Welch et al.
patent: 5087589 (1992-02-01), Chapman et al.
patent: 5468680 (1995-11-01), Cohen

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