Semiconductor device which prevents peeling of...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Reexamination Certificate

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C257S758000, C257S797000, C438S462000

Reexamination Certificate

active

10731148

ABSTRACT:
A semiconductor device includes an alignment mark which is arranged adjacent to each corner of a semiconductor chip, and a plug which contacts the alignment mark. The alignment mark is formed by part of the uppermost interconnection layer in a multilevel interconnection which is formed on the semiconductor chip and obtained by stacking low-permittivity insulating layers and interconnection layers. The plug is buried in a contact hole formed in the low-permittivity insulating layer below the alignment mark, and contacts the alignment mark.

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patent: 5627110 (1997-05-01), Lee et al.
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patent: 2005/0140013 (2005-06-01), Ueno
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patent: 2000-150429 (2000-05-01), None
patent: 2001-15403 (2001-01-01), None
patent: 2002-93750 (2002-03-01), None

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