Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-01-11
2005-01-11
Chambliss, Alonzo (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S773000, C257S783000, C257S786000
Reexamination Certificate
active
06841871
ABSTRACT:
Concerning a plurality of second bonding pads that are electrically connected with a plurality of first bonding pads provided on an IC chip and having a predetermined narrow pitch, a technique is disclosed that allows the plurality of second pads to be provided on the IC chip. This makes it possible to provide the second pads at desired positions. Accordingly, it becomes possible to form, by printing with a low accuracy, respective interconnections that connect the plurality of second pads with a plurality of electrodes provided on a substrate. Also, matching of positions is executed between the plurality of second pads and the plurality of electrodes formed on the substrate by printing. This matching makes it possible to electrically connect the second pads with the electrodes provided on the substrate in a such a manner that they are opposed to each other.
REFERENCES:
patent: 4860087 (1989-08-01), Matsubara et al.
patent: 5135890 (1992-08-01), Temple et al.
patent: 5155068 (1992-10-01), Tada
patent: 5391501 (1995-02-01), Usami et al.
patent: 5604379 (1997-02-01), Mori
patent: 5689136 (1997-11-01), Usami et al.
patent: 5703755 (1997-12-01), Flesher et al.
patent: 5705852 (1998-01-01), Orihara et al.
patent: 5744383 (1998-04-01), Fritz
patent: 5925931 (1999-07-01), Yamamoto
patent: 5986341 (1999-11-01), Usami et al.
patent: 6051877 (2000-04-01), Usami et al.
patent: 6111628 (2000-08-01), Shiota et al.
patent: 6140697 (2000-10-01), Usami et al.
patent: 6166911 (2000-12-01), Usami et al.
patent: 6259158 (2001-07-01), Usami
patent: 6320753 (2001-11-01), Launay
patent: 6459588 (2002-10-01), Morizumi et al.
patent: 63-267598 (1988-11-01), None
patent: 3-87299 (1991-04-01), None
patent: 4-341896 (1992-11-01), None
patent: 7-99267 (1995-04-01), None
patent: 8-15167 (1996-02-01), None
patent: 8-287208 (1996-11-01), None
patent: 9-45724 (1997-02-01), None
“IC Card,” Corporation of the Institute of Electronics, Information and Communication Engineering and published by Ohm Co., Ltd., First Edition, May 25, 1990, p. 33.
LandOfFree
Semiconductor device utilizing pads of different sizes... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device utilizing pads of different sizes..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device utilizing pads of different sizes... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3426219