Fishing – trapping – and vermin destroying
Patent
1990-02-09
1991-12-10
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437212, 437209, 437213, H01L 2144
Patent
active
050717871
ABSTRACT:
In a semiconductor device including a substrate having a wiring layer formed on its major surface and a semiconductor element having an electrode formed on its major surface in which a face-down bonding is achieved with the major surface of the semiconductor element oppositely facing that major surface of the semiconductor substrate which is located opposite to the electrode on the semiconductor element, first bumps formed of gold are formed on the electrode of the semiconductor element, second bumps formed of an indium/tin alloy are formed on the first bumps and an electrical and mechanical bond is achieved, by the second bumps, between the first bumps and the wiring layer in which case the second bumps are heated to an extent not exceeding the melting point of the second bumps.
REFERENCES:
patent: 3531852 (1970-10-01), Slemmons et al.
patent: 3680198 (1972-08-01), Wood
patent: 4494688 (1985-01-01), Hatada
patent: 4693770 (1987-09-01), Hatada
patent: 4749120 (1988-06-01), Hatada
patent: 4784972 (1988-11-01), Hatada
patent: 4876221 (1989-10-01), Hatada
Patent Abstracts of Japan, vol. 12, No. 369 (E-665), Oct. 4, 1988; & JP-A-63 122 155, (Matsushita Electric Ind. Co., Ltd.), 05/26/88.
Mori Miki
Saito Masayuki
Dang Trung
Hearn Brian E.
Kabushiki Kaisha Toshiba
LandOfFree
Semiconductor device utilizing a face-down bonding and a method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device utilizing a face-down bonding and a method , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device utilizing a face-down bonding and a method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1040291