Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-08-14
2007-08-14
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S761000, C257SE23145
Reexamination Certificate
active
11362872
ABSTRACT:
A first insulating film is formed on a semiconductor substrate. A second insulating film made of insulating metal nitride is formed on the first insulating film. A recess is formed through the second insulating film and reaches a position deeper than an upper surface of the first insulating film. A conductive member is buried in the recess. A semiconductor device is provided whose interlayer insulating film can be worked easily even if it is made to have a low dielectric constant.
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Japanese Office Action dated Oct. 31, 2006 (mailing date), issued in corresponding Japanese Patent Application No. 2002-133055.
Kondo Hiroki
Nakao Yoshiyuki
Nishikawa Nobuyuki
Shimizu Noriyuki
Suzuki Takashi
Pham Hoai
Westerman, Hattori, Daniels & Adrian , LLP.
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