Semiconductor device using LED chip

Details Semiconductor device using LED chip Semiconductor device using LED chip

2007-07-10

2007-07-10

Hu, Shouxiang (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S100000, C257S783000

Reexamination Certificate

active

10506826

ABSTRACT:
A semiconductor device includes an insulating substrate2having an obverse surface formed with a die pad3, a rectangular semiconductor chip7such as an LED chip bonded to the die pad with a die bonding material10, and a molded portion9made of a synthetic resin for packaging the semiconductor chip. The die pad3may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.

REFERENCES:
patent: 6291274 (2001-09-01), Oida et al.
patent: 6486543 (2002-11-01), Sano et al.
patent: 6558980 (2003-05-01), Miyaki et al.
patent: 6872661 (2005-03-01), Kwan et al.
patent: 1 156 535 (2001-11-01), None
patent: 62-23119 (1987-01-01), None
patent: 1-157424 (1989-10-01), None
patent: 7-106350 (1995-04-01), None
patent: 8-321634 (1996-12-01), None
patent: 2001-168400 (2001-06-01), None
patent: 2001-358367 (2001-12-01), None
patent: WO 99/60626 (1999-11-01), None

Affiliated with

Also associated with

Rating

Semiconductor device using LED chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device using LED chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device using LED chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3742907