Semiconductor device using annealed bonding wire

Details Semiconductor device using annealed bonding wire Semiconductor device using annealed bonding wire

1992-01-03

1992-10-06

Jackson, Jr., Jerome

Metal fusion bonding

Process

Critical work component, temperature, or pressure

357 72, 228179, 2281802, 228204, 428606, H01L 2328, H01L 2350

Patent

active

051537044

ABSTRACT:
A resin encapsulated semiconductor device comprises a semiconductor element, a conductive base, a wire of aluminum connecting the element and the base, and a thermosetting resin encapsulating hermetically the component to protect the device from a mechanical stress and ambient atmosphere.

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Semiconductor Industry Bonding Handbook, Precision 1977, Small Precision Tools, Inc.
Patent Abstracts of Japan, vol. 6, No. 72, (E-105) (950), May 7, 1982 & JP-A-57 12531, (Fujitsu K.K.), Jan. 22, 1982.

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