Semiconductor device that improves electrical connection...

Details Semiconductor device that improves electrical connection... Semiconductor device that improves electrical connection...

2007-06-12

2007-06-12

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23021, C257SE23144, C257SE23020, C257SE23187, C257SE25029, C257SE23160, C257SE23151, C257S762000, C257S734000, C257S642000, C257S774000, C257S751000, C257S776000, C257S784000

Reexamination Certificate

active

11142324

ABSTRACT:
A semiconductor device including: a semiconductor section in which an element is formed; an insulating layer formed on the semiconductor section; an electrode pad formed on the insulating layer; a contact section formed of a conductive material provided in a contact hole in the insulating layer and electrically connected with the electrode pad; a passivation film formed to have an opening on a first section of the electrode pad and to be positioned on a second section of the electrode pad; a bump formed to be larger than the opening in the passivation film and to be partially positioned on the passivation film; and a barrier layer which lies between the electrode pad and the bump. The contact section is connected with the second section at a position within a range in which the contact section overlaps the bump while avoiding the first section of the electrode pad.

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