Semiconductor device testing apparatus with positioning mechanis

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324158P, G01R 3102

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active

051929082

ABSTRACT:
An apparatus for bringing probe pins of a probe head into contact with electrode terminals of an IC chip to test electrical characteristics of the device is provided. This apparatus includes a test table supported on an X-Y stage. Four chucking positions are formed on a support surface of the test table. Guide plates for positioning two adjacent sides of the IC chip are arranged at each chucking position. A vacuum pad for chucking and fixing the lower surface of the IC chip is arranged at each chucking position. IC chips are respectively placed near the four chucking positions on the support surface. The test table is linearly moved, and the IC chips are slid on the support surface by the inertia force, so that the two sides of each IC chip respectively abut against the corresponding guide plates. The IC chips are simultaneously positioned at the chucking positions, respectively. The IC chips are fixed at the chucking positions by the vacuum pads, respectively. The test table is then moved to a reference test position, and the IC chips are tested using the probe head.

REFERENCES:
patent: 3936743 (1976-02-01), Roch
patent: 4066943 (1978-01-01), Roch
patent: 4758785 (1988-07-01), Rath
patent: 4955590 (1990-09-01), Narushima et al.
patent: 5010296 (1991-04-01), Okada et al.
patent: 5042421 (1991-08-01), Anbe

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