Semiconductor device testing apparatus and semiconductor...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S757020

Reexamination Certificate

active

06864695

ABSTRACT:
Since each wiring line is formed on one surface of the associated beam at a prescribed width over the entire length of the beam, the beam has the same sectional shape taken in the width direction at any point along an arbitrary longitudinal direction of the beam. As a result, the second moment of area, which is determined by the shapes of the beam and the wiring line, is uniform. This prevents a problem of the curvature of a beam varying locally when the beam is bent by a prescribed amount due to contact of the probe with a pad of a subject body. This, in turn, prevents local concentration of stress in the beams and thereby prevents breakage of the beam. Therefore, the probe structure can be miniaturized while the strength of the beams is kept at a required level, whereby a semiconductor device testing apparatus capable of accommodating many probes can be realized.

REFERENCES:
patent: 4961052 (1990-10-01), Tada et al.
patent: 6531327 (2003-03-01), Kanamaru et al.
patent: 7-7052 (1995-01-01), None
patent: 11-094863 (1999-04-01), None
patent: 11-274251 (1999-10-01), None
patent: 2000-171483 (2000-06-01), None
Korean Patent Office Action dated Feb. 28, 2004.

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