Semiconductor device test probe ring apparatus and method of man

Details Semiconductor device test probe ring apparatus and method of man Semiconductor device test probe ring apparatus and method of man

1993-03-25

1995-05-09

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

G01R 1073

Patent

active

054143713

ABSTRACT:
A test probe ring for semiconductor devices is disclosed which contains a ground plane layer, an insulating layer and a layer of electrically separate conductors. A centrally located opening in the layered assembly has a plurality of layered fingers carrying the inner ends of the conductors. A pattern of contact bumps on the free ends of the fingers provides a co-planar pattern of conductor contacts which match a pattern of semiconductor device test pads. The fingers and contacts are formed by cutting kerfs between the conductors at the periphery of the centrally located opening.

REFERENCES:
patent: 4574235 (1986-03-01), Kelly et al.
patent: 5061894 (1991-10-01), Ikeda
patent: 5221895 (1993-06-01), Janko et al.
Contacting A Multitude of Miniscule Nodes, Gerald Jacob, Evaluation Engineering, Aug. 1991.
The Dual Challenges of Wafer Probing, Peter H. Singer, Semiconductor International, Dec. 1989.
The Probe Card Dilemma, Betty Newboe, Semiconductor International, Sep. 1992.

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