Semiconductor device substrate, semiconductor device, and...

Details Semiconductor device substrate, semiconductor device, and... Semiconductor device substrate, semiconductor device, and...

2004-03-29

2008-07-22

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S687000

Reexamination Certificate

active

07402900

ABSTRACT:
A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base and the electronic component; removing a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member; and removing the temporary fixing member, thereby enabling the electronic component to make an external connection.

REFERENCES:
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patent: 5901041 (1999-05-01), Davies et al.
patent: 6570248 (2003-05-01), Ahn et al.
patent: 6586827 (2003-07-01), Takeuchi et al.
patent: 6678167 (2004-01-01), Degani et al.
patent: 6914322 (2005-07-01), Iijima et al.
patent: 04-283987 (1992-10-01), None
patent: 2003-197809 (2003-07-01), None

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