Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2008-02-06
2009-08-25
Ngo, Ngan (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S723000, C257SE23003, C257SE23141
Reexamination Certificate
active
07579691
ABSTRACT:
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.
REFERENCES:
patent: 6274937 (2001-08-01), Ahn et al.
patent: 7045440 (2006-05-01), Huff et al.
patent: 2002/0159242 (2002-10-01), Nakatani et al.
patent: 2004/0238857 (2004-12-01), Beroz et al.
patent: 2005/0045729 (2005-03-01), Yamazaki
patent: 2005/0106839 (2005-05-01), Shimoda et al.
patent: 2005/0231331 (2005-10-01), Kang
patent: 2007/0096160 (2007-05-01), Beroz et al.
patent: 2007/0213610 (2007-09-01), Say et al.
patent: 08-316408 (1996-11-01), None
U.S. Appl. No. 12/026,908, filed Feb. 6, 2008, Sukegawa et al.
U.S. Appl. No. 12/026,842, filed Feb. 6, 2008, Sukegawa et al.
U.S. Appl. No. 12/026,884, filed Feb. 6, 2008, Sukegawa et al.
Sekino Takeo
Shigenami Kenichi
Shimizu Tatsuo
Sukegawa Shunichi
Toi Shinichi
Ngo Ngan
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Sony Corporation
LandOfFree
Semiconductor device, substrate, equipment board, method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, substrate, equipment board, method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, substrate, equipment board, method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4054295