Semiconductor device soldered to a graphite substrate

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Details

357 65, 357 71, H01L 2158, H01L 2314, H01L 2332

Patent

active

044829132

ABSTRACT:
The present invention is directed to a semiconductor device in which a wafer of semiconductor material is soldered to a graphite substrate.

REFERENCES:
patent: 3633076 (1972-01-01), Nurnberg
patent: 4074305 (1978-02-01), Johnston, Jr. et al.
patent: 4077818 (1978-03-01), Chu
patent: 4101925 (1978-07-01), Kelley et al.
patent: 4213801 (1980-07-01), Johnston, Jr.
patent: 4372809 (1983-02-01), Grewal et al.

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