Semiconductor device-socket

Details Semiconductor device-socket Semiconductor device-socket

2002-06-26

2004-03-16

Cuneo, Kamand (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S758010, C439S259000

Reexamination Certificate

active

06707309

ABSTRACT:

This application is based on Patent Application No. 2001-195417 filed Jun. 27, 2000 in Japan, the content of which is incorporated hereinto by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device-socket useable for testing a semiconductor device.
2. Description of the Related Art
Semiconductor devices mounted on an electronic equipment or others are subjected to various tests at a stage prior to being actually mounted so that latent defects therein are removed. The test is performed nondestructively through application of voltage stress, high-temperature operation, and high-temperature storage corresponding to thermal and mechanical environment tests or the like. Among these tests, there is a burn-in test effective for removing initial-inoperable integrated circuits, in which an operation test is performed under a high temperature condition for a predetermined time.
A semiconductor device-socket subjected to such a test as disclosed in Japanese Patent No. 3059946 and as illustrated in
FIG. 11
, for example, is disposed on a printed circuit board
2
that includes an input/output portion, to which portion a predetermined test voltage is supplied and which portion outputs an abnormality-detection signal representing a short-circuit or others is returned from the semiconductor device as an object to be tested and the abnormality detection signal is transmitted.
The semiconductor device-socket comprises a socket body
4
for accommodatinging the contact deviation member
8
relatively movably with respect to a pair of the contact portion of the contact terminal
16
ai
; a positioning member
10
including an accommodation portion
10
a
in which a BGA-type (Ball Grid Array) semiconductor device is loaded as the semiconductor device for example; a contact deviation member
8
for supporting the positioning member
10
arranged in a socket body
4
movably as described later in a reciprocating fashion in a predetermined direction and bringing one of movable contact portion
16
M of a contact terminal
16
ai
described later into close proximity to the other of contact portion
16
F or keeping the one away from the other; and a frame member
12
for transmitting operation force acting on itself to the contact deviation member
8
through a driving mechanism of the contact deviation member
8
(not shown).
At a predetermined position on the printed circuit board
2
are formed a group of electrodes connected electrically to the input/output portion through a conductor layer. To the electrode group is connected a terminal
16
B on a proximal end side of a plurality of the contact terminals
16
ai
(i=1 to n, n is a positive integer.) provided on the socket body
4
disposed on the printed circuit board
2
.
The socket body
4
has thereinside an accommodation portion
4
a
from which the movable contacts
16
M and
16
F of a plurality of the contact terminals
16
ai
are protruded.
Each contact terminal
16
ai
, which is provided corresponding to each electrode portion
6
a
of a mounted semiconductor device
6
, comprises a terminal
16
B on the side of the proximal end and a pair of movable contact portions
16
F and
16
M that are coupled with the just-mentioned terminal
16
B for selectively supporting each electrode portion
6
a
of the semiconductor device
6
. The pair of the movable contact portions
16
F and
16
M approach each other in response to the movement of the contact deviation member
8
to pinch each electrode portion
6
a
of the semiconductor device
6
or are separated from each other to release each electrode portion
6
a
of the semiconductor device
6
as shown FIG.
13
and FIG.
14
.
The contact deviation member
8
is disposed movably in the movement direction of the movable contact portions
16
M and
16
F of each contact terminal
16
ai
in the accommodation portion
4
a
of the socket body
4
. The contact deviation member
8
has an opening through which the movable contacts
16
M and
16
F of each contact terminal
16
ai
are protruded. Each opening is divided with a partition wall (not shown).
A partition wall
8
p
is provided as a movable contact press portion, in each opening portion from which the movable contacts
16
M and
16
F of each contact terminal
16
ai
in the contact deviation member
8
are protruded, which portion
8
p
is formed so as to divide a space between the movable contact
16
M and the movable contact
16
F. Further, between the one end of the contact deviation member
8
and the inner periphery of the accommodation portion
4
a
of the socket body
4
is provided an urging member (not shown) for urging the contact deviation member
8
to return the contact deviation member
8
to an initial position illustrated in FIG.
11
.
As shown in
FIG. 13
, a recessed portion
8
a
is provided in an upper end of the contact deviation member
8
on which a bottom of the positioning member
10
of the contact deviation member
8
is placed, with which a protrusion
10
p
of the positioning member
10
is engaged when the contact deviation member
8
is moved in one direction. As shown therefore in
FIGS. 12 and 13
, the contact deviation member
8
is adapted to be relatively slidable in a predetermined region with respect to the bottom of the contact deviation member and the positioning member
10
, and is moved together with the positioning member
10
.
The contact deviation member
8
is coupled to a driving mechanism composed of a pin and a lever as disclosed in the foregoing Japanese Patent No. 3059946. One end of the lever of the driving mechanism makes contact with an end of the frame member
12
.
Accordingly, when the contact deviation member
8
is moved against the urging force of the coiled spring
14
in the direction indicated by an arrow illustrated in
FIG. 13
in response to the lowering operation of the frame member
12
in the direction indicated by an arrow in
FIG. 11
, the partition wall
8
P is moved so as to separate the movable contact portion
16
M of each contact terminal
16
ai
from the movable contact
16
F. In contrast, as shown in
FIG. 14
, the contact deviation member
8
is moved with the aid of the urging force of the biasing means and the restoring force of the movable contact
16
M oppositely to the direction indicated by the arrow in
FIG. 13
in response to rising operation of the frame member
12
.
As shown in
FIG. 11
, the positioning member
10
includes the accommodation portion
10
a
at the center thereof, in which the semiconductor device
10
is mounted. An inner peripheral surface of the accommodation portion
10
a
comprises flat surfaces with which end surfaces of the square semiconductor device
6
make contact, and a slope that combines the upper end surface and the flat surface, and further a bottom surface intersecting the flat surface. The size of the inner peripheral surface of the accommodation portion
10
a
is set larger than the size of an external appearance of the mounted semiconductor device
6
mounted within a predetermined tolerance.
In the bottom of the accommodation portion
10
a
is formed an opening lob communicated with the opening in the contact deviation member
8
. The protrusion
10
p
that engages a peripheral edge of the recessed portion
8
a
of the contact deviation member
8
is formed at a portion of the bottom of the accommodation portion
10
a
opposing to the contact deviation member
8
. Further, protrusions
10
ca
and
10
cb
are formed on both ends of the bottom of the positioning member
10
on the opposite side of the socket body
4
, the protrusions being guided and restricted by grooves
4
ga
and
4
gb
in the socket body
4
.
The frame member
12
has thereinside an opening to surround an outer periphery of the positioning member
10
. The frame member
12
is supported on the socket body
4
movably up and down with respect to the socket body
4
.
When in such a structure, referring to
FIG. 11
, the semiconductor device
6
is in the state just before it is held with

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