Semiconductor device, semiconductor module, method for...

Details Semiconductor device, semiconductor module, method for... Semiconductor device, semiconductor module, method for...

2009-07-30

2010-11-23

Garber, Charles D (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S666000, C257S712000, C257S730000, C257SE23084, C257SE23124

Reexamination Certificate

active

07839004

ABSTRACT:
To provide a semiconductor device and a semiconductor module in which breakage of a semiconductor element due to a pressing force given from the outside is prevented. A semiconductor device according to the present invention has a configuration mainly including an island, a semiconductor element mounted on a front surface of the island, a lead that functions as an external connection terminal, and a sealing resin that covers these components in an integrated manner and mechanically supports them. Further, a through-hole is provided so as to penetrate the sealing resin. A front surface of the sealing resin around the through-hole forms a flat part. The front surface of the sealing resin that overlaps the semiconductor element is depressed inward with respect to the flat part to form a depressed part.

REFERENCES:
patent: 4460917 (1984-07-01), Rogers
patent: 4888307 (1989-12-01), Spairisano et al.
patent: 5038200 (1991-08-01), Hosomi et al.
patent: 5427938 (1995-06-01), Matsumura et al.
patent: 5663104 (1997-09-01), Fukuyama
patent: 5766985 (1998-06-01), Mangiagli et al.
patent: 6630374 (2003-10-01), Yamamoto
patent: 6667547 (2003-12-01), Woodworth et al.
patent: 2001-320009 (2001-11-01), None

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