Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2011-07-19
2011-07-19
Hoang, Quoc D (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C438S108000, C257SE21499, C257SE23142
Reexamination Certificate
active
07982317
ABSTRACT:
A semiconductor device can include a plurality of semiconductor elements. The characteristics of each of the semiconductor elements can be easily tested during the production of the semiconductor device or when a failure occurs after the semiconductor device is mounted on a substrate, so that the quality can be well managed and a failure can be reliably analyzed. When not mounted on the substrate, the semiconductor device can have a connection structure in which the plurality of semiconductor elements are electrically independent of each other, so that their characteristics can be tested and analyzed by independently energizing the semiconductor elements. In a semiconductor device module having the semiconductor device mounted thereon, the connection structure can include a parallel circuit of the plurality of semiconductor elements. Therefore, all the semiconductor elements can be driven by applying a voltage between a pair of solder-bonding electrode pads disposed on the semiconductor device-mounting substrate.
REFERENCES:
patent: 7009282 (2006-03-01), Golick
patent: 2006/0171135 (2006-08-01), Ishizaka et al.
patent: 2006-222412 (2006-08-01), None
patent: 2006-339540 (2006-12-01), None
patent: 2006-339541 (2006-12-01), None
Hoang Quoc D
Kenealy Vaidya LLP
Stanley Electric Co. Ltd.
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