Semiconductor device sealed with a sealing resin and including s

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

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257686, 257685, 257723, 257730, 257777, 257666, 257676, 438123, 438121, 438106, 438111, 361790, 361820, H01L 2328, H01L 23495, H01L 2160, H01L 2348

Patent

active

061181846

ABSTRACT:
A method of manufacturing a semiconductor device including two semiconductor chips having mutually different element forming face areas on respective surfaces of a die pad of a lead frame prepared by sealing the semiconductor chips with resin by setting the lead frame in a resin sealing use mold having an injection gate for injecting therethrough a sealing resin, includes the steps of: (a) mounting the semiconductor chips on respective surfaces of the die pad in such a manner that when setting the lead frame in the resin sealing use mold, a distance between a side face of the semiconductor chip having a larger element forming face area on the injection gate side and a side face of the semiconductor chip having a smaller element forming face area on the injection gate side becomes shorter than a distance when these semiconductor chips are mounted at a center on respective surfaces of the die pad; (b) setting the lead frame in the resin sealing use mold so that the above side faces of the semiconductor chips are positioned on the injection gate side; and (c) injecting the sealing resin from the injection gate.

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patent: 5834836 (1998-11-01), Park et al.

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