Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2007-05-29
2007-05-29
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257SE23034, C257SE23052, C257SE23124, C257S685000, C257S666000, C257S728000, C257S724000, C257S725000, C257S691000, C257S698000, C257S696000, C257S784000, C257S786000, C257S676000, C257SE25012, C257SE23079, C257S723000, C257S690000, C257S692000
Reexamination Certificate
active
10656434
ABSTRACT:
A semiconductor device which integrates a plurality of semiconductor chips into a single package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of first bonding pads outputting first signals having a first level. The second semiconductor chip includes a plurality of second bonding pads and a plurality of third bonding pads. The plurality of second bonding pads is electrically coupled to a part of the plurality of first bonding pads to receive the first signals having the first level from the first semiconductor chip through the part of the plurality of first bonding pads. The plurality of third bonding pads converts the first signals received through the plurality of second bonding pad into second signals having a second level different from the first level and outputs the second signals through the plurality of third bonding pads.
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Cooper & Dunham LLP
Ricoh & Company, Ltd.
Williams Alexander Oscar
LandOfFree
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