Patent
1983-07-14
1985-10-22
Edlow, Martin H.
357 59, 357 20, 357 71, H01L 2348, H01L 2904, H01L 2906
Patent
active
045491992
ABSTRACT:
A semiconductor device comprises a connection structure composed of a first conductive layer formed in or on a semiconductor substrate, a second conductive layer arranged adjacent to the first conductive layer, and a third conductive layer connecting the first conductive layer to the second conductive layer. The device of the present invention provides a contact structure which can be miniaturized.
REFERENCES:
patent: 4084108 (1978-04-01), Fujimoto
patent: 4376983 (1983-03-01), Tsaur et al.
IEEE Journal of SSC, "A 30 NS 16K.times.1 Fully Static RAM", by Kang et al., vol. SC-16, No. 5, Oct. 1981, pp. 444-448.
Aoyama Keizo
Seki Teruo
Yamauchi Takahiko
Edlow Martin H.
Fujitsu Limited
Henn Terri M.
LandOfFree
Semiconductor device providing a contact structure which can be does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device providing a contact structure which can be , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device providing a contact structure which can be will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-124925