Semiconductor device provided with overheat protection...

Electricity: electrical systems and devices – Safety and protection of systems and devices – Circuit interruption by thermal sensing

Reexamination Certificate

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Reexamination Certificate

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10948693

ABSTRACT:
A overheat protection circuit is formed on the same semiconductor substrate as a power MOS FET is formed on. As the configuration, a first resistor is connected between an input terminal and a gate of the power MOS FET, a second resistor, a temperature sensing element, and a third resistor are connected in this order between the input terminal and a ground point, an FET for clamp is connected in parallel to a series circuit of the temperature sensing element and the third resistor, a series circuit of an FET for current adjustment and a fourth resistor is connected in parallel to the MOS FET for clamp, a series circuit of a fifth and sixth resistors is connected between the input terminal and the ground point, a node of the fifth and sixth resistors is connected to a gate of the FET for current adjustment, an FET for switching is connected between the gate of the power MOS FET and the ground point, and a node of the temperature sensing element and the third resistor is connected to a gate of the FET for switching.

REFERENCES:
patent: 3223851 (1965-12-01), Kitchens et al.
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patent: 4345253 (1982-08-01), Hoover
patent: 4760434 (1988-07-01), Tsuzuki et al.
patent: 6255892 (2001-07-01), Gartner et al.
patent: 6380570 (2002-04-01), Voldman
patent: 6633473 (2003-10-01), Tomomatsu
patent: 63102248 (1988-05-01), None
patent: 63229757 (1988-09-01), None
patent: 2001107980 (2001-12-01), None
DC Biasing. Doug Gingrich. Jul. 13, 1999. <http://www.phys.ualberta.ca/˜gingrich/phy{dot over (s)}395
otes
ode82.html>.
Chinese Office Action dated Oct. 13, 2006 with English translation.
Korean Office Action dated Apr. 25, 2006 with English translation.

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