Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1998-05-22
2000-05-16
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257707, 257712, 257675, 257796, 257717, H01L 2334, H01L 2348, H01L 2940, H05K 720
Patent
active
060641150
ABSTRACT:
A semiconductor device includes a chip forming an integrated circuit, an electrical leadframe, and a heat sink. The passive face of the chip is fixed by adhesive bonding to a bearing face of the heat sink. The leadframe has a central opening giving it the shape of a central leadframe ring, which extends around the chip and which is fixed so as to bear on the bearing face of the heat sink. The central leadframe ring is fixed by soldering to the bearing face of the heat sink respectively at four points far from the corners of the central leadframe ring. The bearing face of the heat sink has alignment and fixing studs which project and are engaged in through-passages in the central leadframe ring.
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Galanthay Theodore E.
SGS-Thomson Microelectronics S.A.
Williams Alexander Oscar
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