Semiconductor device production method

Details Semiconductor device production method Semiconductor device production method

2007-06-26

2007-06-26

Weiss, Howard (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

Reexamination Certificate

active

10704608

ABSTRACT:
A semiconductor device production method including: the step of forming a stopper mask layer of a first metal on a semiconductor substrate, the stopper mask layer having an opening at a predetermined position thereof; the metal supplying step of supplying a second metal into the opening of the stopper mask layer to form a projection electrode of the second metal; and removing the stopper mask layer after the metal supplying step.

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