Semiconductor device processing method

Details Semiconductor device processing method Semiconductor device processing method

1994-11-14

1995-11-28

Kastler, Scott

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 32, 354319, G03D 504

Patent

active

054703921

ABSTRACT:
A semiconductor processing method includes the steps of carrying a case containing semiconductor wafers and to which an ID card is attached into semiconductor processing equipment at a first side of the semiconductor processing equipment; removing the ID card from the case; taking the semiconductor wafers out of the case; carrying the semiconductor wafers taken out of the case into a processing means on a second side, opposite to the first side, of the semiconductor processing equipment; processing the semiconductor wafers in the processing means; attaching the ID card corresponding to the semiconductor wafers to the case; taking the processed semiconductor wafers out of the processing means at the first side of the semiconductor processing equipment; putting the processed semiconductor wafers into the case to which the ID card is attached; and carrying the case outside the semiconductor equipment at the first side of the semiconductor equipment.

REFERENCES:
patent: 4568234 (1986-02-01), Lee et al.
patent: 4658960 (1987-04-01), Iwasa
patent: 4985722 (1991-01-01), Ushijima et al.
patent: 5030057 (1991-07-01), Nishi et al.

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