Semiconductor device power supply wiring structure

Details Semiconductor device power supply wiring structure Semiconductor device power supply wiring structure

1997-01-09

1999-03-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257786, 257784, 257211, 257207, H01L 2704, H01L 2350

Patent

active

058834273

ABSTRACT:
The semiconductor device has a plurality of bonding pads arranged along opposing longitudinal sides of a semiconductor integrated circuit, and the bonding pads are connected to a power supply interconnection layer and a ground interconnection layer which are provided on the main surface of the semiconductor integrated circuit with a film coat interposed. By this structure, it becomes possible to shorten the extension of power supply lines by wirings, and hence power source can be reinforced.

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patent: 5394032 (1995-02-01), Conzelmann et al.
patent: 5446410 (1995-08-01), Nakakura

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