Semiconductor device power interconnect striping

Details Semiconductor device power interconnect striping Semiconductor device power interconnect striping

2007-11-19

2010-06-08

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S107000, C438S121000, C438S666000

Reexamination Certificate

active

07732260

ABSTRACT:
A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

REFERENCES:
patent: 5061989 (1991-10-01), Yen et al.
patent: 5994766 (1999-11-01), Shenoy et al.
patent: 6037677 (2000-03-01), Gottschall et al.
patent: 6448639 (2002-09-01), Ma
patent: 6630737 (2003-10-01), Zhao et al.

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