Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1997-02-19
2000-05-09
Utech, Benjamin L.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
451 60, 451287, 451446, 438692, 438693, C23F 102, B24B 5700
Patent
active
060599200
ABSTRACT:
The first pipe 34 delivers the first solution 21 containing polishing particles. The second pipe 37, containing a liquid mass flow unit 36, delivers the second solution containing a chemical substance. The outlet port of the first pipe and the outlet port of the second pipe are connected to one end portion of the third pipe 31. The third pipe has the other end portion with an inner diameter almost equal to the inner diameter of its one end portion. The first and second solutions introduced into the third pipe are mixed in the third pipe to generate a polishing liquid. The generated polishing liquid is supplied from the other end portion of the third pipe onto a polishing pad 13 to polish a semiconductor wafer 16.
REFERENCES:
patent: 4688945 (1987-08-01), Brazelton et al.
patent: 5375378 (1994-12-01), Rooney
patent: 5407526 (1995-04-01), Danielson et al.
patent: 5478435 (1995-12-01), Murphy et al.
patent: 5609417 (1997-03-01), Otte
patent: 5679063 (1997-10-01), Kimura
patent: 5725417 (1998-03-01), Robinson
patent: 5750440 (1998-05-01), Vanell et al.
patent: 5800251 (1998-09-01), Nakazato et al.
patent: 5857893 (1999-01-01), Olsen et al.
Kawashima Kiyotaka
Nakata Rempei
Nojo Haruki
Champagne Donald L.
Ebara Corporation
Kabushiki Kaisha Toshiba
Utech Benjamin L.
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