Semiconductor device plastic jacket having first and second annu

Details Semiconductor device plastic jacket having first and second annu Semiconductor device plastic jacket having first and second annu

1979-03-12

1980-12-16

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 74, 357 81, 174 52S, 174 52H, H01L 2342, H01L 2344, H01L 2346

Patent

active

042400996

ABSTRACT:
A high performance, wafer-shaped semiconductor device of the type including a wafer-shaped semiconductor element, a pair of electrodes located on the surfaces of the element, a pair of cylindrical metal bodies contacting the electrodes, an insulating ring enclosing and centering the metal bodies and the semiconductor element and a plastic jacket surrounding the insulating ring for tightly encasing the semiconductor device. In addition, there is provided a pair of annular sheet metal strips each of which has an inner edge region fastened to one of the cylindrical metal bodies and a corrugated chemically roughened outer edge region which is embedded in the plastic jacket. A powder coating is applied to the chemically roughened outer edge region for the purpose of providing a pressure and oil-tight housing for the semiconductor device.

REFERENCES:
patent: 3437887 (1969-04-01), Nowalk et al.
patent: 3443168 (1969-05-01), Camp
patent: 3559001 (1971-01-01), Cooper et al.
patent: 3721867 (1973-03-01), Schierz
patent: 3831067 (1974-08-01), Wislocky et al.
patent: 3986201 (1976-10-01), Herold et al.
patent: 4008486 (1977-02-01), Byczkowski

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